ESSCIRC 2023: Multi-gigabit Optical Communications for Automotive
At ESSCIRC 2023, IEEE 49th European Solid-State Circuits Conference, KDPOF will organize the all-day workshop “Multi-gigabit Optical Communications for Automotive” on September 11 from 10:00 to 18:00 WEST in Lisbon, Portugal. The presentations will be by KDPOF and the partner companies Corning, TRUMPF Photonic Components, MD Elektronik, Bosch, and Keysight Technologies.
Unveiling the Future of Automotive Optical Networks
We’re happy to invite you to our exclusive and brand-new multi-gigabit demo with a traffic generator from AUKUA Systems. The setup will be available at scheduled sessions in a private meeting room. In order to book a free space for the demo presentation, please contact us beforehand or visit us at stand 15 from 11 to 14 September 2023 in the Lisbon Congress Centre, Portugal.
ESSCIRC Workshop “Multi-gigabit optical communications for automotive”
Automotive industry is moving towards autonomous driving, which demands a large amount of data to be processed. Optical interconnections are very well positioned because of the high required data rates for connecting sensors and electronic brains with superior EMC performance. Compared with data centers, automotive applications require much wider range of operating temperatures (-40 ºC to 125 ºC) and superior reliability. A new optical physical layer standard has been developed, IEEE Std 802.3cz, supporting rates between 2.5 and 50 Gb/s. The workshop brings together points of view of the main actors involved in the complete solution, i. e. car manufacturer, network, ECU manufacturer, fibre cable interconnections, test and measurement, reliability, photonics, and IC design as well as packaging.
11 September 2023, Lisbon Congress Center (CCL), Room 1.07
10:00 – 10:15 Introduction and motivation of the workshop, Rubén Pérez-Aranda (KDPOF, ES)
10:15 – 10:55 Optical physical layer design and its standardization, Rubén Pérez-Aranda (KDPOF, ES)
10:55 – 11:35 980nm Photonic Components for Automotive Grade Interconnects, Joseph Pankert (TRUMPF Photonic Components, DE)
11:35 – 12:15 Glass Passive Optical Connectivity for Automotive Applications: Characteristics and Robustness, Dave Dawson-Elli (Corning, US)
12:15 – 13:30 Lunch
13:30 – 14:10 Challenges for Optical Multigigabit Connectors and Cable assemblies in the Automotive Environment, Helmut Pritz, Rudolf Engl (MD ELEKTRONIK, DE)
14:10 – 14:50 Semiconductor qualification and reliability assessment for automotive,
David Ortiz Rojo (KDPOF, ES)
14:50 – 15:30 Network level requirements and ECU level integration requirements for multi Gb/s links, Christian Klein (Bosch, DE)
15:30-16:00 Coffee Break
16:00 – 16:35 Test and measurement solution overview for automotive optical PHY testing, Jae-Yong Chang (Keysight Technologies, US)
16:35 – 17:10 Automotive glass-fiber transceivers: Challenges in package development, David Ortiz Rojo (KDPOF, ES)
17:10 – 18:00 Multi-gigabit optical IC design for automotive: design challenges and methodology, Alberto Rodríguez-Pérez (KDPOF, ES)
The aim of ESSCIRC and ESSDERC (IEEE 53rd European Solid-State Device Research Conference) is to provide an annual European forum for the presentation and discussion of recent advances in solid-state devices and circuits. The level of integration for system-on-chip design is rapidly increasing. This is made available by advances in semiconductor technology. Therefore, more than ever before, a deeper interaction among technologists, device experts, IC designers, and system designers is necessary.
More information about the workshop and the event is available at esscirc-essderc2023.org
