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KDPOF (leading supplier for high-speed connectivity over fiber optics in harsh environments) proudly announced their strategic partnership with Hinge Technology (China-based leader in advanced vehicle electronics architecture) to solve key technical issues in the industrial application of optical communications in vehicles.

Strategic Partnership to Advance Automotive Optical Communications for Future Network Demands

For the development and mass production of in-vehicle electrical and electronic architecture of optical fiber communications, Hinge Technology utilizes ICs from KDPOF to design integrated optical modules combined with automotive-grade connectors and optical fiber harnesses to design the electrical electronic architecture (EEA).

 

Yang Jun is CTO of Hinge Technology

Yang Jun is CTO of Hinge Technology

“The widespread application of optical communications in automotive production faces challenges, including harsh environmental conditions and tough requirements for low cost and high reliability,” stated Yang Jun, CTO of Hinge Technology. “Our collaboration with the leading upstream supplier, KDPOF, accelerates the industrialization of vehicle communications system products based on 1 to 50 Gbps optical communications.”

Carlos Pardo is CEO and Co-founder of KDPOF

Carlos Pardo is CEO and Co-founder of KDPOF

 

Carlos Pardo, CEO and Co-founder of KDPOF added: “We’re proud that Hinge Technology has chosen our transceiver ICs for optical gigabit connectivity in harsh environments. At the recent Automotive Ethernet Summit in Shanghai, China, we showed our first joint project: a plastic optical fiber camera by Hinge Technology based on our well-proven KD1053 IC and integrated KD9351 FOT (fiber optic transceiver).”

Surround View System with High-speed Fiber Optics Camera

Joint demo of KDPOF and Hinge Technology of high-speed camera at Automotive Ethernet Summit in Shanghai, China

Joint demo of high-speed camera at Automotive Ethernet Summit in Shanghai, China

Using KDPOF components, Hinge Technology has developed an optical fiber camera. It can be paired with an optical fiber surround view host, resulting in a high-speed optical communications 360-degree surround view system or a reverse image system. The camera utilizes a 2MP high-quality image sensor for data collection, which is processed and transmitted via plastic optical fiber to the controller for image display or processing. Optical fiber cameras can achieve a stable transmission distance of up to 40 meters and deliver high-definition, real-time images. By comparison, LVDS coaxial cameras have no relay transmission capability and are limited to 15 meters.

The KDPOF EVB9351AUT evaluation board provides an extensive platform for testing the KDPOF KD9351 and KD1053 transceivers, designed for the 1000BASE-RHC PHY implementation in automotive optical networks. The KD9351 IC, with dimensions of 7 mm x 8 mm in an LGA-36 package, handles the PMD sublayer of the physical layer. The KD1053, sized at 7 mm x 7 mm in a QFN-56 package, manages both the PCS and PMA sublayers as specified by IEEE Std 802.3bvTM-2017. This setup supports data transfer rates of 1,000 and 100 Mbps.

Additionally, the board features an SFP slot, enabling it to serve as a media converter between the optical 1000BASE-RHC port and various SFP modules. These can include 1000/100BASE-T, 100BASE-FX, 1000BASE-S/LX, direct-attach passive twinax cable, and passive serial loopback configurations.

Joint Research and Design for Future Optical Connectivity

KDPOF team visiting Hinge Technology facilities to work on collaborative projects

KDPOF team visiting Hinge Technology facilities to work on collaborative projects

In addition to developing optical EEA for vehicle communications, KDPOF and Hinge Technology will extend their partnership to the application of optical communications technology in battery management systems (BMS) for electric vehicles. The companies are collaborating on the development and manufacturing of optical modules and system-on-chips (SoC). They plan to introduce optical-electronic integrated chip packaging technology in regions of China with well-developed automotive industry clusters, establishing FAB facilities capable of packaging chips with bandwidths ranging from 1 to 10 gigabits.

Utilizing Chiplet technology solutions, they are jointly researching and developing advanced chip-on-panel (COP) packaging technology for low-cost, high-reliability optical processors, optical modules, and complementary optical components tailored for automotive optical communications. This initiative aims to ensure production capacity for various automotive optical communications products. Together they plan to develop and manufacture higher-bandwidth optical communications semiconductors in the future, driving continuous upgrades of EEA architecture for the global automotive industry.

Furthermore, Hinge Technology conducts relevant functional verification on mass-produced vehicle models, including assessing packet loss rates, signal transmission losses, optical module heat dissipation, optical module and optical connector optical path coupling solutions, and optical connection reliability in various road environments. Based on the results of real vehicle verification, Hinge Technology develops corresponding solutions and provides feedback on technical issues related to optical chips to KDPOF for resolution.

More information is available in the white paper from Hinge Technology.

About Hinge Technology

Hinge Electronic Technology Co., Ltd., was established in 2014 in Shanghai, China with a vision to driving continuous upgrades of EEA architecture for the global automotive industry. Since its creation, Hinge has pioneered the development of advanced automotive systems and products such as the self-adapting AUTOSAR system, in-vehicle TSN (time-sensitive networking) Ethernet, and optical Ethernet, essential technologies in crafting the electronic backbone for the smart vehicles of tomorrow. Powered by its R&D capability, Hinge has forged strategic partnerships with prominent entities (both upstream and downstream) across the automotive sector around the globe. Hinge has built a manufacturing and testing hub in Zhuji city, a facility encompassing 40 hectares with mass production capacity and delivery capability for OEMs.

 

English press release PDF
Chinese press release PDF
German press release PDF

Autonomous Driving Presentation at Automotive Ethernet Summit China

We’re excited to be part of the 5th Automotive Ethernet Summit in Shanghai, China! Óscar Ciordia, Sales and Marketing Director, will give the presentation “Advance 10-Gigabit Ethernet Connection Solution Enables the Development of Autonomous Driving”. From April 11 to 12, 2024, this top automotive Ethernet technology summit in the Asia-Pacific region, gathers dozens of OEMs in its fifth year.
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KDPOF receives IPCEI investments to build an optoelectronics packaging plant in Spain

This is a translated extract of the article “PERTE Chip o la ambición de situar a España enel mapa de los semiconductores” by Marilés de Pedro for Newsbook, first published on 5 February 2024 in Spanish.

‘It is the most ambitious PERTE of the Strategic Projects for Economic Recovery and Transformation. Approved in April 2022, the PERTE Chip has a budget of around 12,250 million euros until 2027 and aims to boost the semiconductor sector in Spain. A PERTE, in line with the provisions of the European Chip Law, which came into force last September and which seeks to promote the strategic autonomy of the EU in this critical area. In Spain, the first aid was granted last December to a total of 15 projects, totaling 50 million euros, thanks to the approval last October of the Addendum to the Recovery Plan, which made it possible to mobilize all the resources allocated to Spain from the NextGeneration EU funds …’

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KDPOF at CHIPNATION Congress

We’re delighted to have been part of the first edition of the CHIPNATION Congress, held on 28 November 2023 in Getafe, Spain. It has been a good opportunity to show our automotive optical gigabit connectivity demo to the Spanish industry and experts. Thank you for all the great and inspiring meetings at our stand. In addition, we enjoyed and profited from interesting conference sessions.

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Carlos Pardo is CEO and Co-founder of KDPOF

We’re proud to congratulate our CEO Carlos Pardo for being awarded Entrepreneur 2023. He’s winner of the 13th edition of the Entrepreneur Awards by Asociación/Colegio Nacional de Ingenieros del ICAI. On October 20, 2023, he will collect the XIII Entrepreneur Award at the ceremony of the 2023 Association Awards.

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KDPOF receives IPCEI investments to build an optoelectronics packaging plant in Spain

KDPOF proudly announced that the European Commission has granted access to the 8.1 billion European investment IPCEI for their projected packaging plant for optoelectronic devices in Spain. “The funding supports us in making our plans of manufacturing ICs in Europe come true in the near future,” stated Carlos Pardo, CEO and Co-founder of KDPOF. “European fabs only manufacture approximately 10 percent of semiconductors worldwide, making us dependent on Asia and the United States. We will pioneer the manufacturing of automotive optoelectronics in Spain in high volume, thus reducing this dependency.” Read more

KDPOF Endorses IEEE 802.3cz Standard Entering the Finishing Straight of Final Release

KDPOF celebrates the advance of the proposed IEEE 802.3cz standard to the IEEE 802.3 Standard Approval Ballot stage.

“We are happy that the IEEE 802.3 automotive optical multi-gigabit standard draft has entered final review for publication,” stated Carlos Pardo, KDPOF CEO and active participant in the IEEE 802.3 working group. “We have started the development of prototypes, led by OEMs in Europe, Asia, and North America, for the proof-of-concept (POC) of optical 10GBASE-AU links for backbone, camera, radar sensor, and display use cases.” Read more

EVB9351-SFP by KDPOF nominated for product 2023 by WEKA Publishing

The German electronics journal Elektronik by WEKA Publishing has chosen our new EVB9351-SFP as one of the finalists in the automotive category for product of 2023. “We’re happy that this first optical 1000BASE-RH Small Form-factor Pluggable transceiver module is nominated for product of the year 2023,” stated our CEO Carlos Pardo. “It integrates the whole 1000BASE-RHC PHY and the header connector for SI-POF optical harness. We’re proud to accomplish the first milestone for future commercial optical 1000BASE-RH SFP modules, which will integrate into the optical ecosystem in automotive.” Test houses welcome the SFP module for the valuation of optical gigabit Ethernet in vehicles. Until January 29, 2023, users are called to vote for their favorite electronics products.

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In collaboration with Ametic, Carlos Pardo will participate in TheMISS Conference, which is accompanying MATELEC trade show.

In collaboration with AMETIC, Carlos Pardo will participate in TheMISS Conference, which is accompanying MATELEC trade show. This leading trade fair for the electrical, electronics, and telecommunications industry is taking place from November 15 to 18, 2022, at IFEMA in Madrid, Spain. On November 18, at 11:30, Carlos will speak about “Spanish and European Proposals to Chip and Semiconductor Shortages” at IFEMA Technology building, Room 3, Pavilion 7. They will discuss strategies and solutions included in PERTE and how companies in Europe are trying to solve the problem locally.
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KDPOF and Keysight Present a Joint Demo of Automotive Ethernet Transmission over Corning ClearCurve® Multi-mode Fiber at IEEE SA Ethernet & IP @ Automotive Technology Day

KDPOF joins forces with Keysight Technologies (leading technology company for advanced design and validation solutions) to advance optical multi-gigabit automotive Ethernet technology. At the IEEE SA Ethernet & IP @ Automotive Technology Day from November 9 to 10, 2022 in Yokohama, Japan, the two technology pioneers will present the first proof of concept demo for the optical automotive ethernet transmitter test including the Corning ClearCurve® multi-mode fibers.

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