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KDPOF (leading supplier for high-speed connectivity over fiber optics in harsh environments) proudly announced their strategic partnership with Hinge Technology (China-based leader in advanced vehicle electronics architecture) to solve key technical issues in the industrial application of optical communications in vehicles.

Strategic Partnership to Advance Automotive Optical Communications for Future Network Demands

For the development and mass production of in-vehicle electrical and electronic architecture of optical fiber communications, Hinge Technology utilizes ICs from KDPOF to design integrated optical modules combined with automotive-grade connectors and optical fiber harnesses to design the electrical electronic architecture (EEA).

 

Yang Jun is CTO of Hinge Technology

Yang Jun is CTO of Hinge Technology

“The widespread application of optical communications in automotive production faces challenges, including harsh environmental conditions and tough requirements for low cost and high reliability,” stated Yang Jun, CTO of Hinge Technology. “Our collaboration with the leading upstream supplier, KDPOF, accelerates the industrialization of vehicle communications system products based on 1 to 50 Gbps optical communications.”

Carlos Pardo is CEO and Co-founder of KDPOF

Carlos Pardo is CEO and Co-founder of KDPOF

 

Carlos Pardo, CEO and Co-founder of KDPOF added: “We’re proud that Hinge Technology has chosen our transceiver ICs for optical gigabit connectivity in harsh environments. At the recent Automotive Ethernet Summit in Shanghai, China, we showed our first joint project: a plastic optical fiber camera by Hinge Technology based on our well-proven KD1053 IC and integrated KD9351 FOT (fiber optic transceiver).”

Surround View System with High-speed Fiber Optics Camera

Joint demo of KDPOF and Hinge Technology of high-speed camera at Automotive Ethernet Summit in Shanghai, China

Joint demo of high-speed camera at Automotive Ethernet Summit in Shanghai, China

Using KDPOF components, Hinge Technology has developed an optical fiber camera. It can be paired with an optical fiber surround view host, resulting in a high-speed optical communications 360-degree surround view system or a reverse image system. The camera utilizes a 2MP high-quality image sensor for data collection, which is processed and transmitted via plastic optical fiber to the controller for image display or processing. Optical fiber cameras can achieve a stable transmission distance of up to 40 meters and deliver high-definition, real-time images. By comparison, LVDS coaxial cameras have no relay transmission capability and are limited to 15 meters.

The KDPOF EVB9351AUT evaluation board provides an extensive platform for testing the KDPOF KD9351 and KD1053 transceivers, designed for the 1000BASE-RHC PHY implementation in automotive optical networks. The KD9351 IC, with dimensions of 7 mm x 8 mm in an LGA-36 package, handles the PMD sublayer of the physical layer. The KD1053, sized at 7 mm x 7 mm in a QFN-56 package, manages both the PCS and PMA sublayers as specified by IEEE Std 802.3bvTM-2017. This setup supports data transfer rates of 1,000 and 100 Mbps.

Additionally, the board features an SFP slot, enabling it to serve as a media converter between the optical 1000BASE-RHC port and various SFP modules. These can include 1000/100BASE-T, 100BASE-FX, 1000BASE-S/LX, direct-attach passive twinax cable, and passive serial loopback configurations.

Joint Research and Design for Future Optical Connectivity

KDPOF team visiting Hinge Technology facilities to work on collaborative projects

KDPOF team visiting Hinge Technology facilities to work on collaborative projects

In addition to developing optical EEA for vehicle communications, KDPOF and Hinge Technology will extend their partnership to the application of optical communications technology in battery management systems (BMS) for electric vehicles. The companies are collaborating on the development and manufacturing of optical modules and system-on-chips (SoC). They plan to introduce optical-electronic integrated chip packaging technology in regions of China with well-developed automotive industry clusters, establishing FAB facilities capable of packaging chips with bandwidths ranging from 1 to 10 gigabits.

Utilizing Chiplet technology solutions, they are jointly researching and developing advanced chip-on-panel (COP) packaging technology for low-cost, high-reliability optical processors, optical modules, and complementary optical components tailored for automotive optical communications. This initiative aims to ensure production capacity for various automotive optical communications products. Together they plan to develop and manufacture higher-bandwidth optical communications semiconductors in the future, driving continuous upgrades of EEA architecture for the global automotive industry.

Furthermore, Hinge Technology conducts relevant functional verification on mass-produced vehicle models, including assessing packet loss rates, signal transmission losses, optical module heat dissipation, optical module and optical connector optical path coupling solutions, and optical connection reliability in various road environments. Based on the results of real vehicle verification, Hinge Technology develops corresponding solutions and provides feedback on technical issues related to optical chips to KDPOF for resolution.

More information is available in the white paper from Hinge Technology.

About Hinge Technology

Hinge Electronic Technology Co., Ltd., was established in 2014 in Shanghai, China with a vision to driving continuous upgrades of EEA architecture for the global automotive industry. Since its creation, Hinge has pioneered the development of advanced automotive systems and products such as the self-adapting AUTOSAR system, in-vehicle TSN (time-sensitive networking) Ethernet, and optical Ethernet, essential technologies in crafting the electronic backbone for the smart vehicles of tomorrow. Powered by its R&D capability, Hinge has forged strategic partnerships with prominent entities (both upstream and downstream) across the automotive sector around the globe. Hinge has built a manufacturing and testing hub in Zhuji city, a facility encompassing 40 hectares with mass production capacity and delivery capability for OEMs.

 

English press release PDF
Chinese press release PDF
German press release PDF

980nm wavelength VCSELs for higher robustness and lifetime // TRUMPF and KDPOF working together to implement new standard in optical data communication within automotive // The target is to bring to the market an integrated transceiver for multi-gigabit optical communications in automotive systems

TRUMPF Photonic Components, a global leader in high-speed VCSEL and photodiode solutions for data communication, and KDPOF, an expert in high-speed optical networking solutions based in Spain, will showcase the first 980nm multi-gigabit automotive interconnect system at the European Conference for Optical Communication (ECOC), to be held in Glasgow on October 1st-5th.

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KDPOF receives IPCEI investments to build an optoelectronics packaging plant in Spain

KDPOF proudly announced that the European Commission has granted access to the 8.1 billion European investment IPCEI for their projected packaging plant for optoelectronic devices in Spain. “The funding supports us in making our plans of manufacturing ICs in Europe come true in the near future,” stated Carlos Pardo, CEO and Co-founder of KDPOF. “European fabs only manufacture approximately 10 percent of semiconductors worldwide, making us dependent on Asia and the United States. We will pioneer the manufacturing of automotive optoelectronics in Spain in high volume, thus reducing this dependency.” Read more

KDPOF Celebrates Release of IEEE 802.3cz-2023 Standard

KDPOF welcomes the publication of the IEEE 802.3cz-2023 standard “IEEE Standard for Ethernet Amendment 7: Physical Layer Specifications and Management Parameters for multi-gigabit glass optical fiber automotive Ethernet” with the final release by the IEEE Standards Association (IEEE SA). This amendment to IEEE Std 802.3-2022 adds Physical Layer specifications and management parameters for 2.5 Gb/s, 5 Gb/s, 10 Gb/s, 25 Gb/s, and 50 Gb/s operation on glass optical fiber in an automotive environment. Read more

KDPOF and Würth Elektronik Cooperate for Optical Automotive Multi-gigabit Ethernet

KDPOF proudly announced their technological cooperation with Würth Elektronik (one of the leading manufacturers of electronics and electromechanical components in Europe) to advance automotive multi-gigabit Ethernet over fiber optics.

“We are honoured to have Würth Elektronik as a partner for our next-generation optical high-speed connectivity reference designs in vehicles,” stated Carlos Pardo, CEO and Co-founder of KDPOF. “As the auto industry approaches the 100 Gb/s*m speed-length threshold, the move from copper to optical physical data transmission media is picking up speed.” Read more

KDPOF proudly announced that their well-proven KD1053 PHY IC and integrated KD9351 FOT (Fiber Optic Transceiver) have been implemented by Renesas, a premier supplier of advanced semiconductor solutions, into the new next generation automotive vehicle computer VC4. This comprehensive communication gateway ECU from Renesas features the newest automotive network technologies and sufficient computing power to host the ever-increasing number of user applications. “With the VC4, we have integrated an optical Ethernet interface into our automotive evaluation boards for the first time,” stated Tobias Belitz, Principal Engineer at Renesas. “KDPOF shared their 1000BASE-RH transceiver KD1053 and KD9351 FOT according to IEEE 802.3bv with us, which also covers the wide temperature range we are looking at.”

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Funzin Integrates KDPOF ICs in New Devices “FAIP 3.0” and “Photon” for autonomous vehicles

At the recent CES 2022, Funzin and KDPOF have jointly presented their optical in-vehicle network solution for autonomous vehicles. Funzin, software development and edge AI solution company, have implemented KDPOF’s KD1053 PHY IC and integrated KD9351 FOT (fiber optic transceiver) in the new Funzin AIoT Platform “FAIP 3.0” and Edge AI Device “Photon” for automotive. Read more

EPIC New Product Event Featuring KDPOF’s Integrated KD9351 FOT

At the recent Members New Product Release Event by EPIC (European Photonics Industry Consortium), César Esteban has presented our integrated KD9351 FOT that reduces cost for gigabit connectivity, thus providing efficient optical technology for safe backbone and ADAS sensor links in vehicles.
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Interview of Alix Paultre, Electronic Design, with Kenny Yoon from KDPOF

Alix Paultre, editor of Electronic Design, has talked with Kenny Yoon, Business Development Manager for South Korea and India at KDPOF, about using optical networking to empower advanced automotive functionality. KDPOF provides innovative high-speed optical networking for harsh environments. Making gigabit communications over fiber optics a reality, KDPOF technology supplies 1-Gb/s plastic optical fiber (POF) links for automotive, industrial, and home networks.

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KDPOF proudly announces that Funzin, software development and edge AI solution company, have integrated their KD1053 IC and integrated KD9351 FOT (fiber optic transceiver) in the new Funzin AIoT Platform “FAIP 3.0” and Edge AI Device “Photon” for automotive. “An automated driving car requires networks capable of controlling and processing a great deal of sensor data,” explained Ms. Deuk Hwa Kim, CEO/President of Funzin. “Our automotive network solution features an Ethernet backbone environment based on plastic optical fiber (POF) to eliminate electronic wave interference.” Read more